A Study on the Effect of Epoxy Molding Compound (EMC) Rheology During Encapsulation of Stacked-CHIP Scale Packages (S-CSP)

Abstract

The numerical and experimental investigations of three-dimensional (3-D) mold filling during encapsulation process in stacked-chip scale package (S-CSP) are presented. The finite difference method (FDM) based on Navier—Stokes equations has been employed for the flow analysis in the mold cavity. The mold flow is assumed to be non-Newtonian and non-isothermal. The proposed models can take care of polymer rheology with cure effect (Castro—Macosko model) and without cure effect (Cross model). A package with five, six, and seven overhang stacking dies without wire bonds is considered for simulation. The epoxy molding compound (EMC) used is HITACHI CEL-9200. The effects of gap between die top and mold cap surface, and between adjacent dies on flow rheology are analyzed and presented. The flow retardation in the limitation region (gap region) and smooth flow in the free region of the package is being predicted. Higher initial conversion of EMC demonstrated higher viscosity and slower melt front advancement especially under the overhang area of same die stacking region and critical gap between the die and mold cap. The void mechanism occurred due to unbalanced mold flow and critical gap clearance. The simulation results are verified with those obtained from a typical electronic industry and found in good agreement. From the results; the Castro—Macosko model is found to be more stable and reliable on the flow rheology.