Investigation on the effect of the packaging-induced stress on the reliability of a MEMS sensor package
Author:
Affiliation:
1. Guilin University of Electronic Technology,School of Mechanical and Electrical Engineering,Guilin,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492084.pdf?arnumber=10492084
Reference8 articles.
1. Film assisted technology for the advanced encapsulation of MEMS/sensors and LEDs
2. Robust Packaging For MEMS Sensors Using Plastic Moulding
3. Application of CAD/CAE/CAM Technology in Plastics Injection Mould Design and Manufacture
4. The application of mold flow simulation in electronic package
5. A Study on the Effect of Epoxy Molding Compound (EMC) Rheology During Encapsulation of Stacked-CHIP Scale Packages (S-CSP)
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