1. Investigation on the effect of the packaging-induced stress on the reliability of a MEMS sensor package;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
2. Dual Row QFN Roughen Lead Frame Mold Flash Challenges & Resolution;2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT);2022-10-19
3. Simulation-based Optimization Design of an Iris Recognition Module Packaging;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10
4. Radiation Pattern Optimization for QFN Packages With On-Chip Antennas at 160 GHz;IEEE Transactions on Antennas and Propagation;2018-09