Dual Row QFN Roughen Lead Frame Mold Flash Challenges & Resolution-Reference-Cited by-同舟云学术

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Dual Row QFN Roughen Lead Frame Mold Flash Challenges & Resolution

Published:2022-10-19 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT)
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Author:

Hiew Pey Fang¹,Eu Poh Leng¹,Hsieh Kirk²,Chen TinaLT²,Yang Milo²,Chan Jaco³,Wang TaiTien⁴,Huang Handsome⁵

Affiliation:

1. NXP Semiconductor,External Package Innovation,Petaling Jaya,Malaysia

2. ASE Global,Engineering Team,Kaohsiung,Taiwan

3. ASE Global,R&D Team,Kaohsiung,Taiwan

4. SQM Team,Engineering Team,Kaohsiung,Taiwan

5. ASE Global,Equipment Team,Kaohsiung,Taiwan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9969384/9969385/09969483.pdf?arnumber=9969483

Reference4 articles.

1. Film assisted technology for the advanced encapsulation of MEMS/sensors and LEDs

2. Study of QFN Pre-tape Material Characteristics & Impacts to Assembly Performance

3. Elimination mold flash by mold design enhancement and leadframe process control on flat power package

4. Design and Process Optimization for Dual Row QFN

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Paddle tilt towards Paddle Flash performance on small outline package;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

2. Lead frame vs. mold via;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

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