A Study of Underfill Dispensing Patterns in Flip-Chip Packaging
Author:
Affiliation:
1. Advanced Semiconductor Engineering, Inc.,Product Characterization,ROC
2. Advanced Semiconductor Engineering, Inc.,Department of Process Engineering III,ROC
3. National Cheng Kung University,Department of Mechanical Engineering,ROC
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10129527/10129646/10129757.pdf?arnumber=10129757
Reference8 articles.
1. Application of multi-quality parameter design in the optimization of underfilling process – a case study of a vehicle electronic module
2. Application of the Underfill Model to Bump Arrangement and Dispensing Process Design
3. Underfill Flow in Flip-Chip Encapsulation Process: A Review
4. Digital twin for secure semiconductor lifecycle: prospects and applications;shaikh,2022
5. A Study on the Effect of Epoxy Molding Compound (EMC) Rheology During Encapsulation of Stacked-CHIP Scale Packages (S-CSP)
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1. Capillary Underfill Flow Simulation as a Design Tool for Flow-Optimized Encapsulation in Heterogenous Integration;Micromachines;2023-09-30
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