Numerical investigation on rheology models during encapsulation of moulded underfill (MUF) for flip-chip package-Reference-Cited by-同舟云学术

Numerical investigation on rheology models during encapsulation of moulded underfill (MUF) for flip-chip package

Published:2023-05-19 Issue:3 Volume:81 Page:2385-2406
ISSN:0170-0839
Container-title:Polymer Bulletin
language:en
Short-container-title:Polym. Bull.

Author:

Azmi Muhammad Afiq,Abdullah Mohd Zulkifly,Shuib Raa Khimi,Ariff Zulkifli Mohamad,Loh Wei Keat,Ooi Renn Chan,Ooi Chun Keang,Abdullah Muhammad Khalil^ORCID

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Polymers and Plastics,Condensed Matter Physics,General Chemistry

Link

https://link.springer.com/content/pdf/10.1007/s00289-023-04805-6.pdf

Reference32 articles.

1. Ardebili H, Pecht MG (2009) Introduction, Encapsulation Technol Electron Appl, pp 1–46. https://doi.org/10.1016/B978-0-8155-1576-0.50005-X

2. Inamdar A, Yang YH, Prisacaru A, Gromala P, Han B (2021) High temperature aging of epoxy-based molding compound and its effect on mechanical behavior of molded electronic package. Polym Degrad Stab. https://doi.org/10.1016/j.polymdegradstab.2021.109572

3. Lee DE, Cho HJ, Kong BS, Choi HO (2019) Investigation on curing characterization of epoxy molding compounds with different latent catalysts by thermal, electrical and mechanical analysis. Thermochim Acta 674:68–75. https://doi.org/10.1016/j.tca.2019.02.009

4. Hu Y et al (2021) Novel micro-nano epoxy composites for electronic packaging application: balance of thermal conductivity and processability. Compos Sci Technol. https://doi.org/10.1016/j.compscitech.2021.108760

5. Venkata Naga Chandana Y, Venu Kumar N (2022) Parametric study of thermally induced warpage of FpBGA package using finite element methods. Mater Today Proc 51:430–434. https://doi.org/10.1016/j.matpr.2021.05.568