High-Speed Differential Via Optimization using a High-Accuracy and High-Bandwidth Via Model

Author:

Li Chaofeng1,Cai Kevin2,Mathew Manish Kizhakkeveettil1,Mousavi Seyedmehdi1,Ouyang Muqi1,Sen Bidyut2,Kim DongHyun Bill1

Affiliation:

1. Missouri University of Science and Technology,EMC Laboratory,Rolla,USA

2. Unified Computing System Cisco Systems, Inc,San Jose,CA,USA

Funder

National Science Foundation

Publisher

IEEE

Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. High-Speed Signal Optimization at Differential VIAs in Multilayer Printed Circuit Boards;Electronics;2024-08-26

2. Hybrid Fast Modeling of Via-Connected Traces in Multilayer Electronic Packages;2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa);2024-05-20

3. Design of high-frequency test fixture considering impedance matching;International Conference on Mechatronic Engineering and Artificial Intelligence (MEAI 2023);2024-02-28

4. A Novel Vertical Conductive Structure for Printed Circuit Boards and its Scalable Model;IEEE Transactions on Signal and Power Integrity;2024

5. A GA-BPNN Collaborative Method Based on High-Quality Datasets for Designing and Optimizing Via-holes Vertical Transition;2023 2nd International Conference on Sensing, Measurement, Communication and Internet of Things Technologies (SMC-IoT);2023-12-29

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