High-Speed Differential Via Optimization using a High-Accuracy and High-Bandwidth Via Model
Author:
Affiliation:
1. Missouri University of Science and Technology,EMC Laboratory,Rolla,USA
2. Unified Computing System Cisco Systems, Inc,San Jose,CA,USA
Funder
National Science Foundation
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10241361/10241364/10241408.pdf?arnumber=10241408
Reference16 articles.
1. Exact Analytical Solution for the Via-Plate Capacitance in Multiple-Layer Structures
2. Improved Expression for the Via-Plate Capacitance Based on the Magnetic-Frill Model
3. Circular Ports in Parallel-Plate Waveguide Analysis With Isotropic Excitations
4. Impedance of an infinitely large parallel-plane pair and its applications in engineering modeling
5. Analytical Evaluation of Via-Plate Capacitance for Multilayer Printed Circuit Boards and Packages
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