Author:
Friedrich Matthias,Bednarz Christian,Leone Marco
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics
Cited by
7 articles.
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1. High-Speed Differential Via Optimization using a High-Accuracy and High-Bandwidth Via Model;2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI);2023-07-29
2. Mode-decomposition-based Equivalent Via (MEV) Model and MEV Model Application Range Analysis;2023 Joint Asia-Pacific International Symposium on Electromagnetic Compatibility and International Conference on ElectroMagnetic Interference & Compatibility (APEMC/INCEMIC);2023-05-23
3. Mode-Decomposition-Based Equivalent Model of High-Speed Vias up to 100 GHz;IEEE Transactions on Signal and Power Integrity;2023
4. Transmission Line Representation of the Capacitive Via-Plate Interaction Toward a Capacitor-Free Via Model;IEEE Transactions on Components, Packaging and Manufacturing Technology;2019-11
5. Fast-Convergent Expression for the Barrel-Plate Capacitance in the Physics-Based Via Circuit Model;IEEE Microwave and Wireless Components Letters;2018-05