Fast-Convergent Expression for the Barrel-Plate Capacitance in the Physics-Based Via Circuit Model
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics
Link
http://xplorestaging.ieee.org/ielx7/7260/8356014/08320278.pdf?arnumber=8320278
Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Mode-Decomposition-Based Equivalent Model of High-Speed Vias up to 100 GHz;IEEE Transactions on Signal and Power Integrity;2023
2. Cylindrical Spoof Surface Plasmon Transmission Line Based on Via Technology;2020 IEEE International Conference on Computational Electromagnetics (ICCEM);2020-08
3. Transmission Line Representation of the Capacitive Via-Plate Interaction Toward a Capacitor-Free Via Model;IEEE Transactions on Components, Packaging and Manufacturing Technology;2019-11
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