Mode-Decomposition-Based Equivalent Model of High-Speed Vias up to 100 GHz
Author:
Affiliation:
1. Missouri S&T EMC Laboratory, Rolla, MO, USA
2. Cisco Systems, Inc., San Jose, CA, USA
Funder
National Science Foundation
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Link
https://ieeexplore.ieee.org/ielam/9745882/10040918/10104134-aam.pdf
Reference46 articles.
1. Analytical Prediction of Crosstalk Among Vias in Multilayer Printed Circuit Boards
2. Signal integrity: Efficient, physics-based via modeling: Principles and methods
3. On Simplified Fast Modal Analysis for Through Silicon Vias in Layered Media Based Upon Full-Wave Solutions
4. Circular Ports in Parallel-Plate Waveguide Analysis With Isotropic Excitations
5. Analyzing Multiple Vias in a Parallel-Plate Pair Based on a Nonorthogonal PEEC Method
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