Hybrid Fast Modeling of Via-Connected Traces in Multilayer Electronic Packages
Author:
Affiliation:
1. The Key Laboratory of Advanced Microelectronic Intelligent Systems and Applications Zhejiang University,College of Information Science and Electronic Engineering,Hangzhou,China,310027
Funder
National Natural Science Foundation of China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10584832/10584581/10585128.pdf?arnumber=10585128
Reference15 articles.
1. Efficient Simulation of Power Distribution Network by Using Integral-Equation and Modal-Decoupling Technology
2. Modeling of Multilayered Power/Ground Planes Based on Resonant Cavity Algorithm
3. Implementation of 3-D Bandstop Frequency-Selective Structures With Ultralarge Angular Stability Utilizing Narrow L-Shaped Strip Lines
4. A Combined Method for Fast Analysis of Signal Propagation, Ground Noise, and Radiated Emission of Multilayer Printed Circuit Boards
5. Deep Learning Inverse Analysis of Higher Order Modes in Monocone TEM Cell
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