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A Combined Method for Fast Analysis of Signal Propagation, Ground Noise, and Radiated Emission of Multilayer Printed Circuit Boards

  • Published:2010-05 Issue:2 Volume:52 Page:487-495
  • ISSN:0018-9375
  • Container-title:IEEE Transactions on Electromagnetic Compatibility
  • language:
  • Short-container-title:IEEE Trans. Electromagn. Compat.

Author:

Duan Xiaomin,Rimolo-Donadio Renato,Brüns Heinz-Dietrich,Schuster Christian

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics

Cited by 25 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Hybrid Fast Modeling of Via-Connected Traces in Multilayer Electronic Packages;2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa);2024-05-20

2. Indefinite Impedance Matrix Techniques for Power Integrity Analysis of Multilayered Printed Circuits;IEEE Transactions on Electromagnetic Compatibility;2023-12

3. SI/PI-Database of PCB-Based Interconnects for Machine Learning Applications;IEEE Access;2021

4. Introducing Functional Via Structures to Low Temperature Cofired Ceramics: How to Optimize Reliably and Efficiently;IEEE Electromagnetic Compatibility Magazine;2021

5. Broadband Green's Function (BBGFL) Method With Imaginary Wavenumber Extractions for Simulations of Radiated Emissions From Irregular Shaped Printed Circuit Board;IEEE Transactions on Electromagnetic Compatibility;2020-10
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