Introducing Functional Via Structures to Low Temperature Cofired Ceramics: How to Optimize Reliably and Efficiently-Reference-Cited by-同舟云学术

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Introducing Functional Via Structures to Low Temperature Cofired Ceramics: How to Optimize Reliably and Efficiently

Published:2021 Issue:4 Volume:10 Page:35-45
ISSN:2162-2264
Container-title:IEEE Electromagnetic Compatibility Magazine
language:
Short-container-title:IEEE Electromagn. Compat. Mag.

Author:

Yildiz Omer F.¹,Pathe Nico²,Bochard Marc³,Yang Cheng⁴,Schuster Christian⁵

Affiliation:

1. Institute of Electromagnetic Theory, TUHH,Germany

2. KOA Europe GmbH,Germany

3. LTCC technology,Germany

4. Institute of Electromagnetic Theory, Technische Universität Hamburg (TUHH),Hamburg,Germany

5. School of Electrical and Computer Engineering of the Georgia Institute of Technology,USA

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Computer Networks and Communications,Instrumentation,Signal Processing,Software

Link

http://xplorestaging.ieee.org/ielx7/5962381/9705258/09705232.pdf?arnumber=9705232

Reference27 articles.

1. S-parameter-based IC interconnect transmission line characterization

2. Planar Circuits for Microwaves and Lightwaves

3. A Combined Method for Fast Analysis of Signal Propagation, Ground Noise, and Radiated Emission of Multilayer Printed Circuit Boards

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Optimization of Ground-via Patterns for via Transitions by Minimizing Loop Inductance;IEEE Transactions on Signal and Power Integrity;2023

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