Publisher
Springer Berlin Heidelberg
Cited by
79 articles.
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1. Modeling Power-Bus Structures with Physics-Informed Neural Networks;2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa);2024-05-20
2. Efficient EMI Analysis and Self-Shielding Design Method for Pin Map of System-in-Package;IEEE Transactions on Electromagnetic Compatibility;2023-12
3. Engineering-Informed Design Space Reduction for PCB-Based Power Delivery Networks;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-10
4. Addressing Load Sensitivity of Rational Macromodels;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-10
5. Triangular Sierpinski Microwave Band-Stop Resonators for K-Band Filtering;Sensors;2023-09-27