Funder
National Natural Science Foundation of China
EMC
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
General Engineering,General Materials Science,General Computer Science
Cited by
8 articles.
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1. Hybrid Fast Modeling of Via-Connected Traces in Multilayer Electronic Packages;2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa);2024-05-20
2. Indefinite Impedance Matrix Techniques for Power Integrity Analysis of Multilayered Printed Circuits;IEEE Transactions on Electromagnetic Compatibility;2023-12
3. Problem Locating Method for PDN Structures with Segmentation Technique;2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC);2023-10-20
4. Impedance modeling and analysis of multi-stacked on-chip power distribution network in 3D ICs;Journal of Computational Electronics;2022-09-16
5. Jitter-Aware Economic PDN Optimization With a Genetic Algorithm;IEEE Transactions on Microwave Theory and Techniques;2021-08