Mode-decomposition-based Equivalent Via (MEV) Model and MEV Model Application Range Analysis-Reference-Cited by-同舟云学术

Mode-decomposition-based Equivalent Via (MEV) Model and MEV Model Application Range Analysis

Published:2023-05-23 Issue: Volume: Page:
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Container-title:2023 Joint Asia-Pacific International Symposium on Electromagnetic Compatibility and International Conference on ElectroMagnetic Interference & Compatibility (APEMC/INCEMIC)
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Author:

Li Chaofeng¹,Cai Kevin²,Ouyang Muqi¹,Mathew Manish Kizhakkeveettil¹,Mousav Mehdi¹,Sen Bidyut²,Kim DongHyun¹

Affiliation:

1. Missouri University of Science and Technology,EMC Laboratory,Rolla,MO,USA

2. Cisco System, Inc,Unified Computing System,San Jose,CA,USA

Funder

National Science Foundation

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10217221/10217352/10217672.pdf?arnumber=10217672

Reference7 articles.

1. Mode-Decomposition-Based Equivalent Model of High-Speed Via up to 100 GHz;li;Progress of Reviewing by IEEE Trans Signal Integrity and Power Integrity,2022

2. An Intrinsic Circuit Model for Multiple Vias in an Irregular Plate Pair Through Rigorous Electromagnetic Analysis

3. Radial-line/coaxial-line junctions: analysis and equivalent circuits

4. Exact Analytical Solution for the Via-Plate Capacitance in Multiple-Layer Structures

5. Improved Expression for the Via-Plate Capacitance Based on the Magnetic-Frill Model

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