Author:
Friedrich M.,Leone M.,Bednarz C.
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics
Cited by
11 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. D-Band Stripline Interconnection Using Capped Cavity via Transition;IEEE Microwave and Wireless Technology Letters;2023-09
2. High-Speed Differential Via Optimization using a High-Accuracy and High-Bandwidth Via Model;2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI);2023-07-29
3. Mode-decomposition-based Equivalent Via (MEV) Model and MEV Model Application Range Analysis;2023 Joint Asia-Pacific International Symposium on Electromagnetic Compatibility and International Conference on ElectroMagnetic Interference & Compatibility (APEMC/INCEMIC);2023-05-23
4. 140-GHz Wideband Array Antenna-in-Package Using Multimode Resonance;IEEE Transactions on Antennas and Propagation;2023-03
5. Mode-Decomposition-Based Equivalent Model of High-Speed Vias up to 100 GHz;IEEE Transactions on Signal and Power Integrity;2023