High-Performance Operation and Solder Reflow Compatibility in BEOL-Integrated 16-kb HfO<sub>2</sub>: Si-Based 1T-1C FeRAM Arrays-Reference-Cited by-同舟云学术

High-Performance Operation and Solder Reflow Compatibility in BEOL-Integrated 16-kb HfO₂: Si-Based 1T-1C FeRAM Arrays

Published:2022-04 Issue:4 Volume:69 Page:2108-2114
ISSN:0018-9383
Container-title:IEEE Transactions on Electron Devices
language:
Short-container-title:IEEE Trans. Electron Devices

Author:

Francois T.¹^ORCID,Coignus J.¹^ORCID,Makosiej A.²,Giraud B.²,Carabasse C.¹,Barbot J.¹,Martin S.¹,Castellani N.¹,Magis T.¹,Grampeix H.¹,Van Duijn S.¹,Mounet C.¹^ORCID,Chiquet P.³,Schroeder U.⁴^ORCID,Slesazeck S.⁴^ORCID,Mikolajick T.⁴^ORCID,Nowak E.¹,Bocquet M.³^ORCID,Barrett N.⁵^ORCID,Andrieu F.¹,Grenouillet L.¹^ORCID

Affiliation:

1. CEA, LETI, University Grenoble-Alpes, Grenoble, France

2. CEA, LIST, University Grenoble-Alpes, Grenoble, France

3. IM2NP, CNRS, Aix Marseille University, Université de Toulon, Marseille, France

4. NaMLab gGmbH, Dresden, Germany

5. SPEC, CEA, CNRS, University Paris-Saclay, CEA Saclay, Gif-sur-Yvette, France

Funder

European Union’s Horizon 2020 Research and Innovation Program

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials