Fan-Out Wafer-Level Packaging for Heterogeneous Integration-Reference-Cited by-同舟云学术

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Fan-Out Wafer-Level Packaging for Heterogeneous Integration

Published:2018-05 Issue: Volume: Page:
ISSN:
Container-title:2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
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Author:

Lau John,Li Zhang,Tan Kim Hwee,Cheung Y.M.,Ng Eric,Lo Penny,Kai Wu,Hao Ji,Wee Koh Sau,Ran Jiang,Xi Cao,Li Ming,Beica Rozalia,Lim Sze Pei,Lee N.C.,Ko Cheng-Ta,Yang Henry,Chen Y.H.,Tao Mian,Lo Jeffery,Lee Ricky,Li Margie,Chen Tony,Xu Iris,Yong Qing Xiang,Cheng Zhong,Fan Nelson,Kuah Eric

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8415930/8429093/08429869.pdf?arnumber=8429869

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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