Advanced 3D Heterogenous Integration (3DHI) for High Frequency RF Applications-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Advanced 3D Heterogenous Integration (3DHI) for High Frequency RF Applications

Published:2024-04-15 Issue: Volume: Page:1-4
ISSN:
Container-title:2024 IEEE Wireless and Microwave Technology Conference (WAMICON)
language:
Short-container-title:

Author:

Gutierrez-Aitken Augusto¹

Affiliation:

1. Northrop Grumman Space Systems,Redondo Beach,CA,USA,90278

Funder

Advanced Research Projects Agency

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10522823/10522798/10522869.pdf?arnumber=10522869

Reference8 articles.

1. Fan-Out Wafer-Level Packaging for Heterogeneous Integration

2. Ponte Vecchio: A Multi-Tile 3D Stacked Processor for Exascale Computing

3. Prospects for High-Efficiency Silicon and III-V Power Amplifiers and Transmitters in 100–300 GHz Bands;Buckwalter

4. InP HBT transferred substrate amplifiers operating to 600 GHz

5. InP HEMT integrated circuits operating above 1,000 GHz

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP