1. A new integration technology platform: integrated fan-out wafer-level-packaging for mobile applications;Yu;Dig. Tech. Pap. - Symp. VLSI Technol.,2015
2. A unique and robust technique to eliminate warpage for FOWLP and FOPLP during the termal debonding process;Sanchez,2019
3. Chip-first fan-out panel-level packaging for heterogeneous integration;Lau;Proc. Electron. Components Technol. Conf.,2018
4. Feasibility study of fan-out wafer-level packaging for heterogeneous integrations;Lau,2019
5. High-performance integrated fan-out wafer level packaging (InFO-WLP): technology and system integration;Liu,2012