Author:
Yong Shaohui,Liu Yuanzhuo,Gao Han,Hinaga Scott,De Soumya,Padilla Darja,Yanagawa Douglas,Drewniak James,Khilkevich Victor
Cited by
10 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Fixture De-Embedding Challenges for Short 2xThru Structure;2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS);2023-12-12
2. 2x-Thru De-embedding Uncertainty for On-Package High-Speed Interconnects;2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS);2022-12-12
3. Dielectric Loss Tangent Extraction Using Two Single-ended Striplines of Different Width;2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI);2022-08-01
4. Extraction of Stripline Surface Roughness Using Cross-section Information and S-parameter Measurements;2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI);2022-08-01
5. An Empirical Modeling of Far-End Crosstalk and Insertion Loss in Microstrip Lines;IEEE Transactions on Signal and Power Integrity;2022