Extraction of Stripline Surface Roughness Using Cross-section Information and S-parameter Measurements
Author:
Affiliation:
1. Missouri University of S&T,EMC Laboratory,Rolla,USA
2. Cadence Design Systems,San Jose,USA
Funder
National Science Foundation
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9889328/9889311/09889527.pdf?arnumber=9889527
Reference16 articles.
1. Dielectric Loss Tangent Extraction Using Modal Measurements and 2-D Cross-Sectional Analysis for Multilayer PCBs
2. A novel de-embedding method suitable for transmission-line measurement
3. Multi-Ports ([$2^{n}$) 2×-Thru De-Embedding: Theory, Validation, and Mode Conversion Characterization
4. Differential S-Parameter De-embedding for 8-Port Network
5. Semi-automatic copper foil surface roughness detection from PCB microsection images
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1. Effects of Non-Gaussian Surface Roughness on Conductor Loss in High-Frequency Transmission Lines;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-05
2. Extraction of Transmission Line Surface Roughness Using S-Parameter Measurements and Cross-Sectional Information;IEEE Transactions on Signal and Power Integrity;2024
3. Characterization of a Microstrip Line Referenced to a Meshed Return Plane Using 2-D Analysis;IEEE Transactions on Signal and Power Integrity;2024
4. Modeling of a Microstrip Line Referenced to a Meshed Return Plane;2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI);2023-07-29
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