2x-Thru De-embedding Uncertainty for On-Package High-Speed Interconnects
Author:
Affiliation:
1. Intel Corporation,Assembly and Test Technology Development,Chandler,AZ,USA
2. Arizona State University,School of Electrical, Computer and Energy Engineering,Tempe,AZ,USA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9994795/9994852/09995177.pdf?arnumber=9995177
Reference12 articles.
1. Impact of Measurement Uncertainty on Correlation Quality for High-Speed Interconnects
2. Measurement Uncertainty Propagation in the Validation of High-Speed Interconnects
3. Machine Learning for Evaluating the Impact of Manufacturing Process Variations in High-Speed Interconnects
4. Temperature Impact on Surface Roughness Modeling for On-Package High Speed Interconnects
5. A Practical De-embedding Error Analysis Method Based on Statistical Circuit Models of Fixtures
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1. Fixture De-Embedding Challenges for Short 2xThru Structure;2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS);2023-12-12
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