Temperature Impact on Surface Roughness Modeling for On-Package High Speed Interconnects-Reference-Cited by-同舟云学术

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Temperature Impact on Surface Roughness Modeling for On-Package High Speed Interconnects

Published:2018-10 Issue: Volume: Page:
ISSN:
Container-title:2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
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Author:

Geyik Cemil S.,Zhang Zhichao,Christ Sean R.,Wojewoda Leigh E.,Aygun Kemal

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8516422/8534194/08534203.pdf?arnumber=8534203

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Measurement of Temperature and Humidity Dependence of Automotive-Grade Interconnects;2023 IEEE 27th Workshop on Signal and Power Integrity (SPI);2023-05-07

2. 2x-Thru De-embedding Uncertainty for On-Package High-Speed Interconnects;2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS);2022-12-12

3. High-density low-loss millimeter-wave package interconnects with the impact of dielectric-material surface roughness;Applied Physics Letters;2021-09-27

4. Impact of Measurement Uncertainty on Correlation Quality for High-Speed Interconnects;IEEE Transactions on Components, Packaging and Manufacturing Technology;2021-09

5. Machine Learning for Evaluating the Impact of Manufacturing Process Variations in High-Speed Interconnects;2021 22nd International Symposium on Quality Electronic Design (ISQED);2021-04-07

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