1. School of Microelectronics, Southern University of Science and Technology (SUSTech), Shenzhen, China
2. Engineering Research Center of Integrated Circuits for Next-Generation Communications, Ministry of Education, School of Microelectronics, Shenzhen Institute of Wide Bandgap Semiconductors, and the GaN Device Engineering Technology Research Center of Guangdong, Southern University of Science and Technology (SUSTech), Shenzhen, China
3. Enkris Semiconductor Inc., Suzhou, China
4. Department of Materials Engineering, The University of British Columbia (UBC), Vancouver, BC, Canada