Study on the Coverage of Metal Thermal Interface Material for Ultra-Large FCBGA Packaging
Author:
Affiliation:
1. ZTE Sanechips,State Key Laboratory of Mobile Network and Mobile Multimedia Technology,Shenzhen,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873241.pdf?arnumber=9873241
Reference9 articles.
1. Metal Thermal Interface Material for the Next Generation FCBGA
2. Intermetallic compound formation and growth behavior at the interface between indium and Au/Ni(V) metallization
3. Parametric study of thermally induced warpage of FpBGA package using finite element methods;chandana;Materials Today Proceedings,2022
4. Assembly Challenges for 75x75mm Large Body FCBGA with Emerging High Thermal Interface Material (TIM)
5. Excessive Warpage of Large Packages During Reflow Soldering
Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Joint Interface Microstructure Analysis of Gallium-based Thermal Interface Material During Reflow;Journal of Electronic Materials;2024-08-17
2. Correlation Analysis between Warpage and Metal Thermal Interface Materials Thermo-mechanical Reliability of Large size FCBGA;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
3. Reliability analysis of metal thermal interface materials for ultra-large size FCLGA package;2023 China Semiconductor Technology International Conference (CSTIC);2023-06-26
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