Author:
Tung Fletcher,Lu Max,Lan Albert,Pan Steward
Cited by
14 articles.
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1. Effect of Thermal Interface Materials on Thermal Performance and Reliability of Large Size Flip Chips;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
2. Bonding Effect of Metal Thermal Interface Material on Oversized Flip Chip Package;2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA);2023-07-24
3. An optimization method of package warpage simulation based on parameter calibration;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10
4. Study on the Coverage of Metal Thermal Interface Material for Ultra-Large FCBGA Packaging;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10
5. TIM Coverage Evaluation for High Performance Computing Application;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31