An optimization method of package warpage simulation based on parameter calibration
Author:
Affiliation:
1. ZTE Sanechips,Department of Packaging and Testing,Shenzhen,China
2. State Key Laboratory of Mobile Network and Mobile Multimedia Technology,Shenzhen,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873402.pdf?arnumber=9873402
Reference6 articles.
1. A study of package warpage for package on package (PoP)
2. Advanced warpage characterization: Location and type of displacement can be equally as important as magnitude;hassell;Proc Pan Pacific Microelectron Symp Conf,2001
3. Indium Thermal Interface Material Development for Microprocessors;toom;2009 IEEE 25 th SEMI-THERM Symposium,2009
4. Warpage reduction of package-on-package (PoP) module by material selection & process optimization
5. Warpage Simulation of a Multilayer Printed Circuit Board and Microelectronic Package Using the Anisotropic Viscoelastic Shell Modeling Technique That Considers the Initial Warpage
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