TIM Coverage Evaluation for High Performance Computing Application-Reference-Cited by-同舟云学术

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TIM Coverage Evaluation for High Performance Computing Application

Published:2022-05-31 Issue: Volume: Page:
ISSN:
Container-title:2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
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Author:

Lin Shane¹,Zhang Ken¹,Lin Vito¹,Lai David¹,Wang Y.P.¹

Affiliation:

1. Siliconware Precision Industries Co., Ltd,Corporate R & D,Taichung,Taiwan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9899435/9899496/09899667.pdf?arnumber=9899667

Reference9 articles.

1. Problems with Thermal Interface Material Measurements: Suggestions for Improvement;lasance,2021

2. Impact of Lifetime and Mechanical Behaviors on TIM Performance for High-End Processor

3. Thermal Interface Materials - A Review of the State of the Art

4. Achieving warpage-free packaging: A capped-die flip chip package design

5. Thermal Interface Material (TIM) Design Guidance For Flip Chip BGA Package Thermal Performance;yuan;CP-01020-1 0,2004

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. High Power Advanced Package with Water Cooling System Evaluation and Optimization;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30

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