Author:
Refai-Ahmed Gamal,Lee Ho Hyung,Do Hoa
Cited by
6 articles.
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1. A Novel Indium Metal Thermal Interface Material and Package Design Configuration to Enhance High-Power Advanced Si Packages Thermal Performance;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
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3. Design and Test of a Low Junction-to-Case Thermal Resistance Packaging Method;IEEE Transactions on Components, Packaging and Manufacturing Technology;2021-12
4. Highly Thermal Dissipation for Large HPC Package Using Liquid Metal Materials;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06
5. Lidless and lidded Flip Chip Packages for Advanced Applications;2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC);2020-12-02