Correlation Analysis between Warpage and Metal Thermal Interface Materials Thermo-mechanical Reliability of Large size FCBGA
Author:
Affiliation:
1. State Key Laboratory of Mobile Network and Mobile Multimedia Technology,Shenzhen,China
2. Sanechips Technology Co., Ltd.,Department of Reliability Engineering,Shenzhen,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492102.pdf?arnumber=10492102
Reference4 articles.
1. Study on the Coverage of Metal Thermal Interface Material for Ultra-Large FCBGA Packaging
2. Metal Thermal Interface Material for the Next Generation FCBGA
3. The Effect of Thermal-Induced Warpage and Degeneration of Thermal Interface Materials on the Thermal Performance of a Flip-Chip Package
4. Reduction of IC Package Warpage through Finite Element Analysis and Direct Optimization
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