Reliability analysis of metal thermal interface materials for ultra-large size FCLGA package-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Reliability analysis of metal thermal interface materials for ultra-large size FCLGA package

Published:2023-06-26 Issue: Volume: Page:
ISSN:
Container-title:2023 China Semiconductor Technology International Conference (CSTIC)
language:
Short-container-title:

Author:

Ouyang Keqing¹,Wu Zhuolun²,Wang Zhuqiu¹,Wang Weilun³,Yang Dan¹,Mei Na²

Affiliation:

1. Sanechips Technology Co., Ltd.,Department of Reliability Engineering,Shenzhen,China,518055

2. State Key Laboratory of Mobile Network and Mobile Multimedia Technology,Shenzhen,China,518055

3. Sanechips Technology Co., Ltd.,Department of Packaging and Testing Engineering,Shenzhen,China,518055

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10219185/10219154/10219399.pdf?arnumber=10219399

Reference3 articles.

1. High Reliability Sintered Silver-Indium Bonding with Anti-Oxidation Property for High Temperature Applications

2. Study on the Coverage of Metal Thermal Interface Material for Ultra-Large FCBGA Packaging

3. Metal Thermal Interface Material for the Next Generation FCBGA

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP