InFO_AiP Technology for High Performance and Compact 5G Millimeter Wave System Integration-Reference-Cited by-同舟云学术

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InFO_AiP Technology for High Performance and Compact 5G Millimeter Wave System Integration

Published:2018-05 Issue: Volume: Page:
ISSN:
Container-title:2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
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Author:

Wang Chuei-Tang,Tang Tzu-Chun,Lin Chun-Wen,Hsu Che-Wei,Hsieh Jeng-Shien,Tsai Chung-Hao,Wu Kai-Chiang,Pu Han-Ping,Yu Douglas

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8415930/8429093/08429552.pdf?arnumber=8429552

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2. Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-05

3. Ultrathin Antenna-in-Package Based on TMV-Embedded FOWLP for 5G mm-Wave Applications;Electronics;2024-02-22

4. A 2 mm Glass-Embedded Fan Out Antenna in Packaging (FO_AiP) for 60 GHz mmWave Applications;2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2023-10-25

5. 4x4 Millimeter-Wave Patch Antenna Array for 5G Communication;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

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