Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz-Reference-Cited by-同舟云学术

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Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz

Published:2024-05 Issue:5 Volume:14 Page:880-890
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Pfahler Tim¹^ORCID,Breun Sascha²^ORCID,Engel Lukas¹^ORCID,Geissler Christian³,Schür Jan¹^ORCID,Vossiek Martin¹^ORCID

Affiliation:

1. Institute of Microwaves and Photonics (LHFT), Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU), Erlangen, Germany

2. Institute for Electronics Engineering, Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU), Erlangen, Germany

3. Infineon Technologies AG, Regensburg, Germany

Funder

Federal Ministry of Education and Research of Germany (BMBF) partly through the Joint Research Project 3DNahRadar

RadarSkin

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx7/5503870/10538069/10496077.pdf?arnumber=10496077

Reference47 articles.

1. Fully Integrated Single-Chip 305–375-GHz Transceiver With On-Chip Antennas in SiGe BiCMOS

2. A SiGe 122-GHz FMCW Radar Sensor with 21.5 dBm EIRP based on a 43-Element Antenna Array in an eWLB Package

3. Wideband and Efficient 256-GHz Subharmonic- Based FMCW Radar Transceiver in 130-nm SiGe BiCMOS Technology

4. On-Chip Integrated Antennas for 200 GHz Applications

5. Distributed on-chip antennas to increase system bandwidth at 180 GHz

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