A Broadband Antenna Array With HDI Technology-Loaded Multilayer Parasitic Patches in W-Band
Author:
Affiliation:
1. School of Integrated Circuits, University of Chinese Academy of Sciences, Beijing, China
2. Microsystem Packaging Research Center Institute of Microelectronics of Chinese Academy of Sciences, Beijing, China
Funder
National Natural Science Foundation of China
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Link
http://xplorestaging.ieee.org/ielx7/7727/10623555/10496965.pdf?arnumber=10496965
Reference23 articles.
1. A Highly Integrated 60 GHz 6-Channel Transceiver With Antenna in Package for Smart Sensing and Short-Range Communications
2. Antenna-in-Package Design for Wirebond Interconnection to Highly Integrated 60-GHz Radios
3. 24-Element Antenna-in-Package for Stationary 60-GHz Communication Scenarios
4. Antenna-in-Package Design Considerations for Ka-Band 5G Communication Applications
5. Mm-Wave Antenna in Package (AiP) Design Applied to 5th Generation (5G) Cellular User Equipment Using Unbalanced Substrate
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