A 2 mm Glass-Embedded Fan Out Antenna in Packaging (FO_AiP) for 60 GHz mmWave Applications
Author:
Affiliation:
1. National Defense University,Department of Mechanical and Aerospace Engineering,Taiwan,R.O.C.
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10348606/10348630/10348893.pdf?arnumber=10348893
Reference7 articles.
1. Wideband Low-profile AMC-based Patch Antenna for 5G Antenna-in-package Application
2. A 2x2 Broadband Dual-Polarized Antenna Array using AiP Techniques for 5G mmWave Beamforming Systems
3. InFO_AiP Technology for High Performance and Compact 5G Millimeter Wave System Integration
4. Multi-port Power Combining Grid Array Antenna on Fan-out Wafer Level Packaging
5. Glass-Embedded Fan-Out Antenna-in-Packaging for 5G Millimeter Wave Applications
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1. Transmission Line Designs on Glass-Embedded Fan Out Antenna in Packaging for 5G Applications;2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP);2024-06-02
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