Multi-port Power Combining Grid Array Antenna on Fan-out Wafer Level Packaging-Reference-Cited by-同舟云学术

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Multi-port Power Combining Grid Array Antenna on Fan-out Wafer Level Packaging

Published:2020-07 Issue: Volume: Page:
ISSN:
Container-title:2020 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)
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Author:

Chen Zihao,Zhu Xi,Zhong Lin

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9194033/9199648/09199675.pdf?arnumber=9199675

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A 2 mm Glass-Embedded Fan Out Antenna in Packaging (FO_AiP) for 60 GHz mmWave Applications;2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2023-10-25

2. Analysis of On-Antenna Power Combining for Realization of Pattern-Reconfigurable Multifeed Microstrip Antennas;IEEE Transactions on Antennas and Propagation;2023-04

3. Characteristics of Glass-Embedded FOAiP with Antenna Arrays for 60GHz mmWave Applications;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

4. 28 GHz compact dipole antenna array integrated in fan-out eWLB package;International Journal of Microwave and Wireless Technologies;2022-02-21

5. 28 GHz circular polarized fan‐out antenna array with wide‐angle beam‐steering;International Journal of RF and Microwave Computer-Aided Engineering;2021-12-02

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