Ultra-Fine Pitch 3D Integration Using Face-to-Face Hybrid Wafer Bonding Combined with a Via-Middle Through-Silicon-Via Process-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Ultra-Fine Pitch 3D Integration Using Face-to-Face Hybrid Wafer Bonding Combined with a Via-Middle Through-Silicon-Via Process

Published:2016-05 Issue: Volume: Page:
ISSN:
Container-title:2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
language:
Short-container-title:

Author:

Kim Soon-Wook,Detalle Mikael,Peng Lan,Nolmans Philip,Heylen Nancy,Velenis Dimitrios,Miller Andy,Beyer Gerald,Beyne Eric

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7542794/7545393/07545574.pdf?arnumber=7545574

Cited by 38 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Room-Temperature Hybrid Bonding of Via-middle TSV Wafer Fabricated by Direct Si/Cu Grinding and Residual Metal Removal;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Hybrid Bonding for Ultra-High-Density Interconnect;Journal of Electronic Packaging;2024-03-08

3. Thermally-Aware Multi-Core Chiplet Stacking;2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD);2023-10-28

4. Selective Self-Assembled Monolayer for Copper Surface Protection During Plasma Activation of Hybrid-Bonded Wafers;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

5. Magnetic alignment technology for wafer bonding;Microelectronics International;2023-04-20

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP