Selective Self-Assembled Monolayer for Copper Surface Protection During Plasma Activation of Hybrid-Bonded Wafers-Reference-Cited by-同舟云学术

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Selective Self-Assembled Monolayer for Copper Surface Protection During Plasma Activation of Hybrid-Bonded Wafers

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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Author:

Rogers Jack¹,Netzband Chris¹,Hoshino Satohiko¹,Antonovich Nathan¹,Kramer Vanessa¹,Tuchman Andrew¹

Affiliation:

1. TEL Technology Center, America, LLC,Albany,United States

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195410.pdf?arnumber=10195410

Reference10 articles.

1. Area-Selective Atomic Layer Deposition Assisted by Self-Assembled Monolayers: A Comparison of Cu, Co, W, and Ru

2. Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding

3. Area-Selective Deposition: Fundamentals, Applications, and Future Outlook

4. Scalable, sub 2μm pitch, Cu/SiCN to Cu/SiCN hybrid wafer-to-wafer bonding technology

5. Wafer-to-wafer bonding for microstructure formation

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