High-Frequency Analysis of Embedded Microfluidic Cooling within 3-D ICs Using a TSV Testbed-Reference-Cited by-同舟云学术

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High-Frequency Analysis of Embedded Microfluidic Cooling within 3-D ICs Using a TSV Testbed

Published:2016-05 Issue: Volume: Page:
ISSN:
Container-title:2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
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Author:

Oh Hanju,Zhang Xuchen,May Gary S.,Bakir Muhannad S.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7542794/7545393/07545413.pdf?arnumber=7545413

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. An ultra-deep TSV technique enabled by the dual catalysis-based electroless plating of combined barrier and seed layers;Microsystems & Nanoengineering;2024-06-11

2. Electrical-Thermal Co-analysis of TSV Embedded Microfluidic Pin-fin Heatsink for High Power Dissipation with High Bandwidth Density;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. Coupled Electrical–Thermal–Fluidic Multi-Physics Analysis of Through Silicon Via Pin Fin Microchannel in the Three-Dimensional Integrated Circuit;Journal of Electronic Packaging;2023-06-06

4. Integrated closed cooling system for high-power chips;Case Studies in Thermal Engineering;2021-08

5. Advances in thermal conductivity for energy applications: a review;Progress in Energy;2021-01-01

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