1. DARPA’s Intra/Interchip Enhanced Cooling (ICECool) Program;Avram,2013
2. High-frequency analysis of embedded microfluidic cooling within 3-D ICs using a TSV testbed;Oh;IEEE 66th Electronic Components and Technology Conference (ECTC),2016
3. Monolithic integration of a micropin-fin heat sink in a 28-nm FPGA;Sarvey;IEEE Transactions on Components, Packaging and Manufacturing Technology,2017
4. Chip-Embedded pumped two phase cooling;Pritish,2016
5. Embedded Microfluidic Cooling of High Heat Flux Electronic Components;John,2014