Panel Level Advanced Packaging-Reference-Cited by-同舟云学术

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Panel Level Advanced Packaging

Published:2016-05 Issue: Volume: Page:
ISSN:
Container-title:2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
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Author:

McCleary Roger,Cochet Philippe,Swarbrick Tom,Sim ChinTiong,Singh Gurvinder,Bum Yong Chang,Aung Andy Kyawoo

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7542794/7545393/07545406.pdf?arnumber=7545406

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Warpage Estimation of Panel-Level Packaging by AI-assisted Design on Simulation;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07

2. Analysis of Pattern Distortion by Panel Deformation and Addressing it by Using Extremely Large Exposure Field Fine-Resolution Lithography;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

3. Special glass for packaging of high frequency electronics;2021 51st European Microwave Conference (EuMC);2022-04-04

4. Advanced Outlier Die Control Technology in Fan-Out Panel Level Packaging Using Feedforward Lithography;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06

5. Methods for latent image simulations in photolithography with a polychromatic light attenuation equation for fabricating VIAs in 2.5D and 3D advanced packaging architectures;Microsystems & Nanoengineering;2021-05-25

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