Analysis of Pattern Distortion by Panel Deformation and Addressing it by Using Extremely Large Exposure Field Fine-Resolution Lithography
Author:
Affiliation:
1. Onto Innovation Inc.,Massachusetts,USA,01887
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816380.pdf?arnumber=9816380
Reference8 articles.
1. Foplp Lithography Solutions to Overcome Die Placement Error, Predict Yield, Increase Throughput and Reduce Cost
2. advanced Insulating Film for Next-Generation Smartphone Performance Requirements;nishimura;ECTC2019,0
3. Improved compensation for a reduction stepper to meet the challenges for advanced packaging applications
4. Panel Level Advanced Packaging
5. Analysis of overlay distortion patterns;armtiage,0
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