Advanced Outlier Die Control Technology in Fan-Out Panel Level Packaging Using Feedforward Lithography-Reference-Cited by-同舟云学术

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Advanced Outlier Die Control Technology in Fan-Out Panel Level Packaging Using Feedforward Lithography

Published:2021-06 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
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Author:

Chang John,Lu Jian,Ali Burhan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501886.pdf?arnumber=9501886

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. State-Of-The-Art of Advanced Packaging;Chiplet Design and Heterogeneous Integration Packaging;2023

2. Multiple System and Heterogeneous Integration with TSV-Less Interposers;Chiplet Design and Heterogeneous Integration Packaging;2023

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