Special glass for packaging of high frequency electronics
Author:
Affiliation:
1. SCHOTT AG,Mainz,Germany,55122
2. SCHOTT Glass Technologies (Suzhou) Co., Ltd.,Suzhou,China,215009
3. Institute of Radioelectronics and Multimedia Technology, Warsaw University of Technology,Poland
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9784154/9783612/09784272.pdf?arnumber=9784272
Reference19 articles.
1. Development of mold-first fan-out panel-level packaging (fo-plp) on 600mm x 600mm size panel;rao;2020 IEEE 70th Electronic Components and Technology Conference (ECTC),0
2. Direct copper metallization on glass technology + x-substrate
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