MMIC-to-Dielectric Waveguide Transitions for Glass Packages Above 150 GHz
Author:
Affiliation:
1. Institute of Microwave Engineering Ulm University, Ulm, Germany
2. Endress+Hauser SE+Company KG, Maulburg, Germany
3. Fraunhofer IZM, Berlin, Germany
4. LPKF Laser & Electronics AG, Garbsen, Germany
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Radiation
Link
http://xplorestaging.ieee.org/ielx7/22/10169131/10025405.pdf?arnumber=10025405
Reference41 articles.
1. 90 Degree Microstrip to Rectangular Dielectric Waveguide Transition in the W-Band
2. High-Gain Millimeter-Wave Holographic Antenna in Package Using Glass Technology
3. Silicon Taper Based $D$ -Band Chip to Waveguide Interconnect for Millimeter-Wave Systems
4. A Wide-Band Dual-Polarized Stacked Patch Antenna
5. Ortho-Mode Sub-THz Interconnect Channel for Planar Chip-to-Chip Communications
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1. RF Glass Technology Is Going Mainstream: Review and Future Applications;IEEE Journal of Microwaves;2023-04
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