RF Glass Technology Is Going Mainstream: Review and Future Applications-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

RF Glass Technology Is Going Mainstream: Review and Future Applications

Published:2023-04 Issue:2 Volume:3 Page:783-799
ISSN:2692-8388
Container-title:IEEE Journal of Microwaves
language:
Short-container-title:IEEE J. Microw.

Author:

Chaloun Tobias¹^ORCID,Brandl Susanne¹^ORCID,Ambrosius Norbert²^ORCID,Kröhnert Kevin³,Maune Holger⁴^ORCID,Waldschmidt Christian¹^ORCID

Affiliation:

1. Institute of Microwave Engineering, Ulm University, Ulm, Germany

2. LPKF Laser and Electronics AG, Garbsen, Germany

3. Fraunhofer IZM, Berlin, Germany

4. High Frequency and Communication Engineering, Otto-von-Guericke-Universität Magdeburg, Magdeburg, Germany

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

General Earth and Planetary Sciences,General Environmental Science

Link

http://xplorestaging.ieee.org/ielx7/9171629/10091703/10091719.pdf?arnumber=10091719

Reference176 articles.

1. Investigation of Au/Si Eutectic Wafer Bonding for MEMS Accelerometers

2. Micro-Hole Drilling on Glass Substrates—A Review

3. Approaches for a Solely Electroless Metallization of Through-Glass Vias

4. Laser Welding of Glass Replaces Glueing Procedure

5. Wafer-to-wafer bonding for microstructure formation

Cited by 14 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Low insertion loss interposer approach for RF applications based on commercial LTCC tape, alkaline-free glass and printed metallization;Materials Research Bulletin;2024-10

2. D-Band Corrugated Horn Antenna Using Multilayer Structured-Glass Technology;IEEE Antennas and Wireless Propagation Letters;2024-09

3. A Core-Shell Lens for Antenna On-Package Integration at D-Band;IEEE Transactions on Antennas and Propagation;2024-08

4. Measurement-Based Characterization of Subterahertz Metasurfaces Designed to Work in a 300-GHz Band: Suitability for broader band communication in 6G;IEEE Antennas and Propagation Magazine;2024-08

5. A Foil Flip-Chip Interconnect With an Ultra-Broadband Bandwidth of 130 GHz and Beyond for Heterogeneous High-End System Designs;IEEE Journal of Microwaves;2024-07

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3