2.5D Large-Scale Interposer Bonding Process Verification using Daisy-Chain for PIM Heterogeneous Integration Platform
Author:
Affiliation:
1. Electronics and Telecommunications Research Institute (ETRI),AI SoC Research Division,Daejeon,Republic of Korea
Funder
National Research Foundation of Korea
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10049840/10049805/10049851.pdf?arnumber=10049851
Reference5 articles.
1. S-Connect Fan-out Interposer For Next Gen Heterogeneous Integration
2. Embedded Multi-die Interconnect Bridge (EMIB) -- A High Density, High Bandwidth Packaging Interconnect
3. Signal Integrity(SI) aware HBM2e/3 interposer design approach considering y-axis offset between logic and HBM die for HPC/AI/Network applications
4. Reliability Performance of Advanced Organic Interposer (CoWoS®-R) Packages
5. Novel 2.5D RDL Interposer Packaging: A Key Enabler for the New Era of Heterogenous Chip Integration
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