Author:
Lin Po-Yao,Yew M. C.,Yeh S. S.,Chen S. M.,Lin C. H.,Chen C. S.,Hsieh C. C.,Lu Y. J.,Chuang P. Y.,Cheng H. K.,Jeng Shin-Puu
Cited by
24 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Reliability and Chiplets;IEEE Reliability Magazine;2024-06
2. Single and Multi NPU Chiplet Heterogeneous Integration packaging based on Fanout RDL interposer with Silicon bridge technology;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
3. Next Generation Large Size High Interconnect Density CoWoS-R Package;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
4. A Warpage Investigation for a Large Panel-sized Interposer with Embedded Dies;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
5. Chiplet Communications (Bridges);Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024